SAN FRANCISCO, July 24, 2026 /PRNewswire/ -- ARBOR Technology Corp. has launched its next-generation COM-HPC module, COMX-C710, powered by the new AMD Ryzen™ AI Embedded X100 Series processors.

Forbes contributors publish independent expert analyses and insights. Marco Chiappetta is a technologist who covers semiconductors and AI. This voice experience is generated by AI. Learn more. This ...

With the AuraStack AI Super Agent, Cadence is now the only provider with agentic AI solutions spanning the full electronic system design flow, from digital and analog silicon design, advanced ...

LOS ANGELES--(BUSINESS WIRE)--Quilter, the first and only company to publicly demonstrate fully autonomous PCB layout through physics-driven AI, today announced $25 million in Series B funding led by ...

Generative artificial intelligence (AI) represents the next great step forward in PCB design. This is, of course, what you might expect me to say. 2023 has been a year dominated by the rise of ...

The evolution of PCBs from large and antiquated “printed wiring boards” to today’s fine-line designs on high-density interconnect (HDI) PCBs, IC substrates (ICS) and more, has been matched by ...

(MENAFN- EIN Presswire) EINPresswire/ -- Unigen Corporation, a global leader in the design and manufacturing of enterprise and industrial electronics, today announced the expansion of its AI product ...

High-bandwidth, low-latency connectivity is a must-have in modern data centers. The only challenge? As more CPUs, GPUs, AI accelerators, and memory chips are piled into the data center, they’re being ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world’s first agentic AI platform for printed circuit board ...

Cadence has introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio, the world’s first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers ...