Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

Austin, Oct. 20, 2025 (GLOBE NEWSWIRE) -- Power Module Packaging Market Size & Growth Insights: According to the SNS Insider,"The Power Module Packaging Market size was valued at USD 2.53 Billion in ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

In order to increase power module yield and reliability, companies are working on new products for power packaging, especially for the common failure locations, die and substrate attach, ...

Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Good morning, good evening. Thank you all for attending the conference call with ASE. I'm Sunny Lin, covering Greater China [ Semis ] at UBS. It's my great honor to host Mr. Yin Chang, Executive VP of ...

The KARNO Power Module received the highest overall vote across all six categories of Consulting-Specifying Engineer’s 2026 Product of the Year program. CSE community selected the KARNO Power Module ...

SOUTH KOREA, May 21, 2026 /EINPresswire.com/ — South Korea-based semiconductor company SEMIPOWER is developing next-generation power semiconductor module solutions ...

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