Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
By measuring each wafer after lithography and adjusting the next etch step, fabs can pull more wafers back into spec.
Ying-Lang Wang is in the Department of Electrical Engineering, National Cheng Kung University, Tainan City, Taiwan, Republic of China. Mao-Chih Huang is in the Department of Electrical Engineering, ...
In smart manufacturing, timely and accurate data flow is critical. Manufacturers seek to monitor every step in their process to ensure optimal results. However, significant challenges include ...
Author Dr. R. Russell Rhinehart discusses his new book, Nonlinear Model-Based Control: Using First-Principles Models in Process Control, and explains why nonlinear first-principles models should be ...
Aim: To demonstrate the potential of in-line nanoparticle size measurements using the NanoFlowSizer (NFS) as a PAT method. To achieve real-time process control by establishing automated regulation of ...
The process control and instrumentation minor emphasizes developing skills and knowledge in theory, software and in the field. Students graduate ready to solve complex control problems in the chemical ...
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