The system integration challenge is evolving, but existing tools and methods are not keeping up with the task. New tools and flows are needed to handle global concepts, such as power and thermal, that ...

In this chapter, we report our broad conclusions related to each of the themes we introduced at the start of the report. These conclusions reflect detailed consideration of (1) our research into ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Today’s semiconductor designs support a broad range of applications, from mobile and edge devices to AI accelerators and data center systems. To keep pace, design teams are shifting from monolithic ...

As electrification, automation, and intelligent machine design reshape the industry, HYDAC helps OEMs optimize complete ...

The Department of Energy’s National Nuclear Security Administration has awarded The Aerospace Corp. a master indefinite-delivery/indefinite-delivery contract worth ...

BAE Systems has secured a U.S. Navy contract worth $122 million to perform systems engineering and integration support services and conduct special studies aimed at enhancing the service branch’s ...

ITT Systems Corporation, Colorado Springs, Colorado, is being awarded two contract modifications valued at a total of nearly $94 million for the Systems Engineering and Sustainment Integrator (SENSOR) ...

LinQuest Corp., Los Angeles, California, has been awarded a $76,637,171 cost-plus-fixed-fee modification (P00014) to contract FA8808-19-C-0006 for system engineering, integration and test support for ...

NOTICE: The project that is the subject of this report was approved by the Governing Board of the National Research Council, whose members are drawn from the councils of the National Academy of ...